Technical Conference

Tuesday–Thursday, March 31–April 2

This technical conference is known worldwide as one of the finest and most selective in the world. Take advantage of new research and innovations from key industry players in the areas of board fabrication and design and electronics assembly. New sessions this year include a focus on moisture sensitivity, high temperature processing, die attach, and electronics and the environment. That's in addition to our annual focus on the key areas of soldering, advanced packaging, materials and reliability.

Sign up for one day, the full conference or get the most for your money with the Maximum Value Package. Find the package to suit your needs here (.pdf). Sign up by March 4 and save 20%. Download the hard copy brochure here (.pdf)

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